PackageTSOP
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Technical Specifications
Micron NAND256W3A2AN6F technical specifications.
General
| Address Bus Width | 25b |
| Package/Case | TSOP |
| Density | 256Mb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | SLC NAND, |
| Min Operating Temperature | -40°C |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Micron NAND256W3A2AN6F Datasheet
Download the complete datasheet for Micron NAND256W3A2AN6F to view detailed technical specifications.
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