PackageDO-35
MountingThrough Hole
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Technical Specifications
Microsemi 1N6027B technical specifications.
General
| Package/Case | DO-35 |
| Contact Plating | Tin, Lead |
| Impedance | 950R |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Mount | Through Hole |
| Packaging | Bulk |
| RoHS Compliant | No |
| Tolerance | 5% |
| Zener Voltage | 130V |
Compliance
| RoHS | Not Compliant |
Datasheet
Microsemi 1N6027B Datasheet
Download the complete datasheet for Microsemi 1N6027B to view detailed technical specifications.
No datasheet is available for this part.