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Technical Specifications
Microsemi 1N6312US technical specifications.
General
| Package/Case | MELF |
| Contact Plating | Tin, Lead |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Mount | Surface Mount |
| Power Dissipation | 500mW |
| Radiation Hardening | Yes |
| RoHS Compliant | No |
| Voltage Tolerance | 5% |
| Zener Voltage | 3.3V |
Compliance
| RoHS | Not CompliantYes |
Datasheet
Microsemi 1N6312US Datasheet
Download the complete datasheet for Microsemi 1N6312US to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.