MountingThrough Hole
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Technical Specifications
Microsemi 1N717A technical specifications.
General
| Contact Plating | Tin, Lead |
| Element Configuration | Single |
| Impedance | 11R |
| Max Power Dissipation | 250mW |
| Mount | Through Hole |
| Packaging | Bulk |
| RoHS Compliant | No |
| Tolerance | 5% |
| Zener Voltage | 13V |
Compliance
| RoHS | Not Compliant |
Datasheet
Microsemi 1N717A Datasheet
Download the complete datasheet for Microsemi 1N717A to view detailed technical specifications.
No datasheet is available for this part.