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Technical Specifications
Microsemi 1N767 technical specifications.
General
| Contact Plating | Tin, Lead |
| Max Power Dissipation | 250mW |
| Mount | Through Hole |
| RoHS Compliant | No |
Compliance
| RoHS | Not Compliant |
Datasheet
Microsemi 1N767 Datasheet
Download the complete datasheet for Microsemi 1N767 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.