MountingThrough Hole
Power500mW
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Technical Specifications
Microsemi 1N938B technical specifications.
General
| Contact Plating | Tin, Lead |
| Element Configuration | Single |
| Impedance | 20R |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Mount | Through Hole |
| Packaging | Bulk |
| Power Dissipation | 500mW |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Voltage Tolerance | 5% |
| Zener Voltage | 9V |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Microsemi 1N938B Datasheet
Download the complete datasheet for Microsemi 1N938B to view detailed technical specifications.
No datasheet is available for this part.