PackageTQFP
Quick Jump:
Technical Specifications
Microsemi A2F060M3E-1TQG144 technical specifications.
General
| Package/Case | TQFP |
| Core Architecture | ARM |
| Height | 1.4mm |
| Interface | I2C, SPI, UART, USART, EBI/EMI |
| Length | 20mm |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Max Supply Voltage | 1.575V |
| Min Supply Voltage | 1.425V |
| Number of I/Os | 70 |
| Number of Registers | 1536 |
| Operating Supply Voltage | 1.5V |
| Package Quantity | 60 |
| Packaging | Tray |
| Peripherals | POR, WDT, DMA |
| Radiation Hardening | No |
| RAM Size | 16384b |
| RoHS Compliant | Yes |
| Series | SmartFusion® |
| Speed Grade | 1 |
| Weight | 0.04653oz |
| Width | 20mm |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi A2F060M3E-1TQG144 Datasheet
Download the complete datasheet for Microsemi A2F060M3E-1TQG144 to view detailed technical specifications.
No datasheet is available for this part.
Product Images
