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Technical Specifications
Microsemi A2F200M3F-1CS288 technical specifications.
General
Package/Case
TFBGA
Core Architecture
ARM
Interface
I2C, SPI, Ethernet, UART, USART, EBI/EMI
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Packaging
Tray
Peripherals
POR, WDT, DMA
RAM Size
64KB
RoHS Compliant
No
Series
SmartFusion®
Compliance
RoHS
Not Compliant
Datasheet
Microsemi A2F200M3F-1CS288 Datasheet
Download the complete datasheet for Microsemi A2F200M3F-1CS288 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.