Frequency231MHz
PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Microsemi A3P1000-FGG256I technical specifications.
General
Package/Case
FBGA
Height
1.6mm
Lead Free
Lead Free
Length
17mm
Max Frequency
231MHz
Max Operating Temperature
85°C
Memory Size
147456b
Min Operating Temperature
-40°C
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Mount
Surface Mount
Number of Gates
1000000
Number of I/Os
177
Number of Logic Elements/Cells
11000
Operating Supply Current
75mA
Operating Supply Voltage
1.5V
Package Quantity
90
RAM Size
147456b
RoHS Compliant
Yes
Series
ProASIC3
Width
17mm
Compliance
RoHS
Compliant
Datasheet
Microsemi A3P1000-FGG256I Datasheet
Download the complete datasheet for Microsemi A3P1000-FGG256I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.