The APA300-FGG256M is a 300,000-gate field-programmable gate array (FPGA) from Microsemi. It operates at a maximum frequency of 180 MHz and is powered by a supply voltage between 2.3V and 2.7V. The device is packaged in a flip-chip ball grid array (FBGA) and is rated for operation over the temperature range of -55°C to 125°C. The APA300-FGG256M is RoHS compliant and is available in trays of 90 units.
Frequency180MHz
PackageFBGA
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Technical Specifications
Microsemi APA300-FGG256M technical specifications.
General
| Package/Case | FBGA |
| Height | 1.2mm |
| Length | 17mm |
| Max Frequency | 180MHz |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Max Supply Voltage | 2.7V |
| Min Supply Voltage | 2.3V |
| Number of Gates | 300000 |
| Number of I/Os | 186 |
| Number of Registers | 8192 |
| Operating Supply Voltage | 2.5V |
| Package Quantity | 90 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 73728b |
| RoHS Compliant | Yes |
| Series | ProASICPLUS |
| Weight | 0.01411oz |
| Width | 17mm |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi APA300-FGG256M Datasheet
Download the complete datasheet for Microsemi APA300-FGG256M to view detailed technical specifications.
No datasheet is available for this part.