PackageCDIP
MountingThrough Hole
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Technical Specifications
Microsemi DLTS30 technical specifications.
General
| Package/Case | CDIP |
| Direction | Unidirectional |
| Min Breakdown Voltage | 33.3V |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Reverse Leakage Current | 2uA |
| Mount | Through Hole |
| Packaging | Rail/Tube |
| Peak Pulse Current | 10A |
| Peak Pulse Power | 500W |
| Radiation Hardening | No |
| Reverse Standoff Voltage | 30V |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi DLTS30 Datasheet
Download the complete datasheet for Microsemi DLTS30 to view detailed technical specifications.
No datasheet is available for this part.