PackageCDIP
MountingThrough Hole
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Technical Specifications
Microsemi SG1731J/883B technical specifications.
General
| Package/Case | CDIP |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| RoHS Compliant | No |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Microsemi SG1731J/883B Datasheet
Download the complete datasheet for Microsemi SG1731J/883B to view detailed technical specifications.
No datasheet is available for this part.