Frequency500kHz
PackageDIP
MountingThrough Hole
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Technical Specifications
Microsemi SG2526BN technical specifications.
General
| Package/Case | DIP |
| Duty Cycle | 49% |
| Fall Time | 100ns |
| Lead Free | Lead Free |
| Max Duty Cycle | 49% |
| Max Frequency | 500kHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -25°C |
| Max Supply Voltage | 35V |
| Mount | Through Hole |
| Number of Outputs | 2 |
| Package Quantity | 2500 |
| Packaging | Rail/Tube |
| Quiescent Current | 18mA |
| RoHS Compliant | Yes |
| Topology | Push-Pull |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi SG2526BN Datasheet
Download the complete datasheet for Microsemi SG2526BN to view detailed technical specifications.
No datasheet is available for this part.