PackagePDIP
MountingThrough Hole
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Technical Specifications
Microsemi SG2825CN technical specifications.
General
| Package/Case | PDIP |
| Fall Time | 30ns |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -25°C |
| Mount | Through Hole |
| Output Current | 200mA |
| Packaging | Bulk |
| Radiation Hardening | No |
| RoHS Compliant | No |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Microsemi SG2825CN Datasheet
Download the complete datasheet for Microsemi SG2825CN to view detailed technical specifications.
No datasheet is available for this part.