PackageDIP
MountingThrough Hole
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Technical Specifications
Microsemi SG3081J/883B technical specifications.
General
| Package/Case | DIP |
| Mount | Through Hole |
| Packaging | Bulk |
| Radiation Hardening | No |
| RoHS Compliant | No |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Microsemi SG3081J/883B Datasheet
Download the complete datasheet for Microsemi SG3081J/883B to view detailed technical specifications.
No datasheet is available for this part.