PackageSOIC
MountingSurface Mount
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Technical Specifications
Microsemi SMCG6057/TR13 technical specifications.
General
| Package/Case | SOIC |
| Direction | Bidirectional |
| Duty Cycle | 70% |
| Min Breakdown Voltage | 50.4V |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Reverse Leakage Current | 5uA |
| Mount | Surface Mount |
| Package Quantity | 2500 |
| Packaging | Tape and Reel |
| Peak Pulse Current | 18.6A |
| Peak Pulse Power | 1.5kW |
| Reverse Standoff Voltage | 45V |
| RoHS Compliant | No |
| Topology | Boost, Flyback |
Compliance
| RoHS | Not Compliant |
Datasheet
Microsemi SMCG6057/TR13 Datasheet
Download the complete datasheet for Microsemi SMCG6057/TR13 to view detailed technical specifications.
No datasheet is available for this part.