PackageDIP
MountingThrough Hole
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Technical Specifications
Nuvoton W77L532A25DL technical specifications.
General
| Package/Case | DIP |
| Core Architecture | 8051 |
| Interface | Serial, EBI/EMI |
| Max Operating Temperature | 70°C |
| Memory Size | 128KB |
| Memory Type | FLASH, |
| Min Operating Temperature | 0°C |
| Mount | Through Hole |
| Number of I/Os | 32 |
| Oscillator Type | Internal |
| Packaging | Rail/Tube |
| Peripherals | POR, WDT |
| RoHS Compliant | Yes |
| Series | W77 |
Compliance
| RoHS | Compliant |
Datasheet
Nuvoton W77L532A25DL Datasheet
Download the complete datasheet for Nuvoton W77L532A25DL to view detailed technical specifications.
No datasheet is available for this part.