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Technical Specifications
NXP MCE360CZQ25LR2 technical specifications.
General
Package/Case
BGA
Core Architecture
Coldfire
Data Bus Width
32b
Halogen Free
Not Halogen Free
Max Frequency
25MHz
Max Operating Temperature
105°C
Min Operating Temperature
-40°C
Number of Cores
1
Package Quantity
180
Packaging
Tape and Reel
Radiation Hardening
No
RAM Size
2.5KB
Series
M683xx
Weight
0.076675oz
Compliance
RoHS
Not CompliantNo
Datasheet
NXP MCE360CZQ25LR2 Datasheet
Download the complete datasheet for NXP MCE360CZQ25LR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.