8-bit CISC microcontroller featuring an 80C51 core, 1KB Flash program memory, and 128B RAM. Operates at up to 18 MHz with dual timers and SPI interface. Housed in a 14-pin TSSOP package with gull-wing leads for surface mounting, offering a 0.65mm pin pitch and a maximum package height of 0.95mm. Supports 2.5V/3.3V operation and a wide temperature range of -40°C to 125°C.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP P89LPC912HDH,129 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
5.1(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AB-1
Family Name
LPC900
Data Bus Width
8bit
Instruction Set Architecture
CISC
Maximum Clock Rate
18MHz
Maximum CPU Frequency
18MHz
Device Core
80C51
Program Memory Type
Flash
Program Memory Size
1KB
RAM Size
128B
Number of Programmable I/Os
12
Core Architecture
8051
Programmability
Yes
Number of Timers
2
Interface Type
SPI
CAN
0
I2C
0
SPI
1
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP P89LPC912HDH,129 Datasheet
Download the complete datasheet for NXP P89LPC912HDH,129 to view detailed technical specifications.
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