Frequency250.075MHz
PackageLFBGA
Current28mA
MountingSurface Mount
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Technical Specifications
NXP PX1011B-EL1/G,551 technical specifications.
General
Package/Case
LFBGA
Data Rate
2.5Gbps
Height
1.2mm
Interface
SPI
Lead Free
Lead Free
Length
9.1mm
Max Frequency
250.075MHz
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Max Power Dissipation
300mW
Max Supply Voltage
3.6V
Min Supply Voltage
1.15V
Mount
Surface Mount
Number of Channels
1
Number of Functions
1
Operating Supply Voltage
3.3V
Package Quantity
260
Packaging
Tray
RoHS Compliant
Yes
Supply Current
28mA
Supply Voltage-Nom
3.6V
Type
Integrated Circuit (IC)
Width
9.1mm
Compliance
RoHS
Compliant
Datasheet
NXP PX1011B-EL1/G,551 Datasheet
Download the complete datasheet for NXP PX1011B-EL1/G,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.