PackageSIL9MPF
MountingThrough Hole
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Technical Specifications
NXP TDA2615/N1,112 technical specifications.
General
Package Family Name
SIL9MPF
Package/Case
SIL9MPF
Pin Count
9
PCB
9
Tab
Tab
Package Length (mm)
21.8(Max)
Package Width (mm)
3.7(Max)
Package Height (mm)
6.48(Max)
Seated Plane Height (mm)
18.5(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Function
Speaker
Amplifier Type
Class-AB
Input Signal Type
Single
Output Signal Type
Single
Output Type
2-Channel Stereo
Maximum Input Bias Current
0.3(Typ)@±12VuA
Maximum Output Current
4000mA
Min Operating Temperature
-25°C
Max Operating Temperature
150°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA2615/N1,112 Datasheet
Download the complete datasheet for NXP TDA2615/N1,112 to view detailed technical specifications.
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