NXP
TDA8026ET/C2,557
Multiple smart card slot interface / Tray, Bakeable, Multiple in Drypack RoHS Compliant: Yes
PackageTFBGA
Current55mA
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Technical Specifications
NXP TDA8026ET/C2,557 technical specifications.
General
Package/Case
TFBGA
Interface
I2C
Max Operating Temperature
85°C
Min Operating Temperature
-25°C
Max Power Dissipation
665mW
Operating Supply Voltage
5.5V
Package Quantity
2080
Packaging
Tray
RoHS Compliant
Yes
Supply Current
55mA
Type
Integrated Circuit (IC)
Compliance
RoHS
Compliant
Datasheet
NXP TDA8026ET/C2,557 Datasheet
Download the complete datasheet for NXP TDA8026ET/C2,557 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.