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Technical Specifications
Onsemi P2008AG-08TT technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
3.1(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AA
Number of Outputs per Chip
1
Input Logic Level
Crystal
Compliance
Cage Code
5V1P1
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Onsemi P2008AG-08TT Datasheet
Download the complete datasheet for Onsemi P2008AG-08TT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.