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30157-33

Description:

MPU Geode GXLV 32bit 0.25um 233MHz 352-Pin BGA

Introduction date:

Apr 1, 2000

Updated: +90 days


See moreMicroprocessors - MPUs by Texas Instruments

Online version: https://www.datasheets.com/part-details/30157-33-texas-instruments-16003324

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
noNo
RoHS Version
2011/65/EU, 2015/863
Automotive
noNo
Supplier Cage Codeinfo
01295
HTSUSAinfo
8542310001
Schedule Binfo
8542310000
PPAP
noNo
Category Path
Semiconductor > Microcontrollers and Processors > Processors > Microprocessors - MPUs

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Lead Finish(Plating)info
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Under Plating Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Supplier Temperature Grade
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Maximum Storage Temperature
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Minimum Storage Temperature
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Memory Card Interface
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On-Chip Memory
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Operating Supply Voltage
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I/O Voltage
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Maximum Power Dissipation
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Temperature Flag
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Programmability
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Tradename
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Family Name
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Data Bus Width
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Instruction Set Architecture
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Core Architecture
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SATA
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PCIe
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Operating Systems
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Low Power Mode
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Graphics Acceleration
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External Memory Interface
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Device Core
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Number of CPU Cores
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Maximum Speed
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Interface Type
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Minimum Operating Supply Voltage
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CAN
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Typical Operating Supply Voltage
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UART
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USART
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I2C
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SPI
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USB
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Ethernet
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I2S
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Instruction Cache Size
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Data Cache Size
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Multiply Accumulate
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Ethernet Interface Type
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Ethernet Speed
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Maximum Operating Supply Voltage
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Process Technology
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Minimum Operating Temperature
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Maximum Operating Temperature
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30157-33