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74ALVCH16245DGG,11

74ALVCH16245DGG,11

Nexperia

Description:

Bus XCVR Dual 16-CH 3-ST 48-Pin TSSOP T/R

Country of Origin:

China

Introduction date:

Jun 16, 1998

Updated: 22-MAR-2024


See moreBus Transceivers by Nexperia

Online version: https://www.datasheets.com/part-details/74alvch16245dgg-11-nexperia-81819334

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
H2HX9
HTSUSAinfo
8542390001
Schedule Binfo
8542390060
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > Transceivers > Standard Logic > Bus Transceivers

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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buy onlineBuy now

By purchasing the component directly from our verified distributors, you can enjoy a convenient and secure buying experience, with the assurance that you are obtaining genuine components from trustworthy sources.

Distributor

Stock

Price

Arrow Americas

Recommended

Arrow Americas

$0.4599

Min. Quantity: 2000
Future Electronics
Future Electronics
Chip1Stop
Chip1Stop
Verical
Verical
2,000

$0.7949

Min. Quantity: 2000

packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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Jedec
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Jedec info (PKG outline)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Reflow Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum High Level Output Current
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Number of Channels per Chip
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Minimum Storage Temperature
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Maximum Storage Temperature
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Number of Selection Inputs per Element
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Number of Input Enables per Element
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Number of Output Enables per Element
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Maximum Power Dissipation
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Number of Direction Control Inputs
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Input Level
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Output Level
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Bus Hold
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Propagation Delay Test Condition
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Supplier Temperature Grade
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Typical Quiescent Current
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Maximum Quiescent Current
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Maximum Low Level Output Current
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Maximum Supply Current
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Typical Supply Current
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Absolute Propagation Delay Time
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Maximum Propagation Delay Time @ Maximum CL
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Logic Family
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Logic Function
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Data Flow Direction
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Number of Elements per Chip
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Triggering Type
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Polarity
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Process Technology
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Output Type
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Tolerant I/Os
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Minimum Operating Supply Voltage
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Minimum Operating Temperature
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Typical Operating Supply Voltage
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Maximum Operating Temperature
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Maximum Operating Supply Voltage
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74ALVCH16245DGG,11

74ALVCH16245DGG,11By Nexperia