APAM1568YE15V2.0

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Version: 03-AUG-2018 (Latest)Version: 17-JUL-2017 Version: 23-JUN-2014

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Package Family Name

Supplier Package

Package Description

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Package Diameter (mm)

Mounting

Package Outline

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Reflow Temp. Source

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Minimum Storage Temperature

Supplier Temperature Grade

Process Technology

Maximum Storage Temperature

Typical Noise Figure

Modulation Technique

Maximum Operating Frequency

Minimum Operating Supply Voltage

Typical Operating Supply Voltage

Maximum Operating Supply Voltage

Minimum Operating Temperature

Maximum Operating Temperature

Crosses

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