ATSAM3X8EA-AU

Description:

MCU 32-bit ARM Cortex M3 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin LQFP Tray

Country of Origin:

China

Introduction date:

Feb 17, 2012

Updated:06-NOV-2024

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCyclePremium
EU RoHS Yes
RoHS Version2011/65/EU, 2015/863
3A991.a.2
Automotive No
Supplier Cage Code60991
8542310025
Schedule B8542310025
PPAP No
AEC Qualified No
Category Path
Semiconductor > Microcontrollers and Processors > Microcontrollers > Microcontrollers - MCUs

Datasheet

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Datasheet Preview

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
Package Family Name
Supplier Package
Package Description
Lead Shape
Pin Count
PCB
Package Diameter (mm)
Package Material
Mounting
Package Outline
Jedec
Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Reflow Temp. Source
Wave Temp. Source

Reference designs

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CAD Models

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Crosses

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