ATSAM4S-XPRO

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Version: 20-AUG-2017 (Latest)Version: 31-MAY-2015 Version: 30-MAR-2015 Version: 10-SEP-2013

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Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Standard

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Cellular Support

Cellular Type

Ethernet Speed

PCIe

PWM Pins

Operating Supply Voltage

Analog Pins

I2S

ICSP Header

Minimum Storage Temperature

Maximum Storage Temperature

Supported PMIC Devices

Compatible External Board

Tradename

Temperature Flag

Supplier Temperature Grade

Minimum Operating Temperature

Maximum Operating Temperature

Product Weight

Type

Supported Device

Supported Device Technology

Maximum Clock Rate

RAM Size

Program Memory Size

Program Memory Type

USB

RS232

Ethernet

I2C

CAN

SATA

SPI

UART

ADC

GPIO

Display Interface

Display Type

IDE

PC Card Interface

JTAG Support

Audio Interfaces

Wi-Fi

Bluetooth

Touchscreen

PWM

Real Time Clock

RF

Number of LEDs

Main Program Memory Type

Operating Systems

Android

Linux

Windows

Daughter Cards

Product Length

Product Depth

Product Width

Crosses

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