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ATWINC3400-XSTK

ATWINC3400-XSTK

Microchip Technology

Description:

WINC3400-MR210CA Combo Wireless Module Evaluation Kit

Introduction date:

Dec 13, 2016

Updated: 22-MAR-2024


See moreRF/Wireless Development Boards and Kits by Microchip Technology

Online version: https://www.datasheets.com/part-details/atwinc3400-xstk-microchip-technology-75297018

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs unknownUnknown
RoHS Version
2011/65/EU
ECCNinfo
5A992.c
Automotive
noNo
Supplier Cage Codeinfo
60991
HTSUSAinfo
8517620090
Schedule Binfo
8473300002
Category Path
Semiconductor > Development Systems > Evaluation, Development Boards and Kits > RF/Wireless Development Boards and Kits

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

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ATWINC3400-XSTK

ATWINC3400-XSTKBy Microchip Technology