BGA7351,515
Grade Your BOM

Description:

RF Amp Dual VGA 500MHz 5.25V 32-Pin HVQFN EP T/R

Country of Origin:

China

Introduction date:

Dec 28, 2011

Updated: 03-JUL-2024


See moreRF Amplifiers by NXP Semiconductors

Online version: https://www.datasheets.com/part-details/bga7351-515-nxp-semiconductors-47288497

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
H2J65
HTSUSAinfo
8542330001
Schedule Binfo
8542330000
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > RF and Microwave > RF Amplifiers > RF Amplifiers

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Package Diameter (mm)
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Mounting
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Package Outline
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Minimum Storage Temperature
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Maximum Storage Temperature
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Typical Dual Supply Voltage
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Supplier Temperature Grade
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Typical Gain Flatness
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Maximum Output Return Loss
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Typical Output Intercept Point
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Maximum Reverse Isolation
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Maximum Power Dissipation
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Typical Output Power
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Operational Bias Conditions
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Typical 3rd Order Output Intercept Point @ Bias Conditions
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Typical Single Supply Voltage
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Maximum Input Return Loss
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Power Supply Type
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Typical Power Added Efficiency
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Process Technology
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Warranty
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Maximum Input Power
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Typical Insertion Loss
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Manufacturer Type
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Type
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Number of Channels per Chip
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Minimum Operating Frequency
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Maximum Operating Frequency
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Typical Output Power Range
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Typical 3dB Bandwidth
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Typical Output 1dB Compressed Power @ Bias Conditions
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Typical Noise Figure
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Minimum Single Supply Voltage
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Maximum Single Supply Voltage
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Minimum Dual Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Dual Supply Voltage
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Maximum Supply Current
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Minimum Operating Temperature
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Maximum Operating Temperature
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Maximum Input VSWR
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Maximum Output VSWR
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Typical Power Gain
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BGA7351,515

BGA7351,515By NXP Semiconductors