BS250CSM4-QR-EB

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Version: 23-MAR-2000 (Latest)

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type

Package Family Name

Supplier Package

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Weight (g)

Package Material

Mounting

Package Outline

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Reflow Temp. Source

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Typical Gate to Source Charge

Maximum Junction Ambient Thermal Resistance

Maximum Junction Case Thermal Resistance

Typical Rise Time

Typical Turn-Off Delay Time

Supplier Temperature Grade

Typical Turn-On Delay Time

Breakdown Voltage Type

Minimum DC Current Gain

Typical Reverse Recovery Charge

Typical Forward Transconductance

Typical Switch Charge

Tradename

Minimum Gate Threshold Voltage

Maximum Offset Voltage

Typical Reverse Transfer Capacitance @ Vds

Maximum Positive Gate Source Voltage

Minimum Gate Resistance

Maximum Gate Resistance

Typical Gate Threshold Voltage

Typical Diode Forward Voltage

Maximum Diode Forward Voltage

Typical Reverse Recovery Time

Maximum Pulsed Drain Current @ TC=25°C

Maximum Forward Transconductance

Minimum Forward Transconductance

Minimum IDSS

ID For GFS

VDS For GFS

Maximum Input Capacitance @ Vds

Typical IDSS

Typical Fall Time

Maximum Gate Source Leakage Current

Maximum Storage Temperature

Operating Junction Temperature

Typical Gate Resistance

Typical Gate to Drain Charge

Minimum Storage Temperature

Configuration

Category

Maximum Absolute Continuous Drain Current

Channel Mode

Channel Type

Number of Elements per Chip

Process Technology

Maximum Drain Source Voltage

Maximum Gate Source Voltage

Maximum Continuous Drain Current

Material

Maximum Gate Threshold Voltage

Maximum Drain Source Resistance

Maximum IDSS

Typical Gate Charge @ Vgs

Typical Gate Charge @ 10V

Typical Input Capacitance @ Vds

Maximum Power Dissipation

Minimum Operating Temperature

Maximum Operating Temperature

Typical Output Capacitance

Crosses

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