CY14B108L-BA25XI

CY14B108L-BA25XI

Infineon Technologies AG

Description:

NVRAM NVSRAM Parallel 8Mbit 3V 48-Pin FBGA Tray

Country of Origin:

Taiwan

Introduction date:

Dec 14, 2007

Updated: 09-MAY-2024


See moreNVRAM by Infineon Technologies AG

Online version: https://www.datasheets.com/part-details/cy14b108l-ba25xi-infineon-technologies-ag-34732711

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
3A991.b.2.a
Automotive
noNo
Supplier Cage Codeinfo
C6489
HTSUSAinfo
8542320041
Schedule Binfo
8542320040
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > Memory > Memory Chips > NVRAM

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Minimum Storage Temperature
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Operating Supply Voltage
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Supplier Temperature Grade
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Process Technology
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Maximum Storage Temperature
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Density
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Type
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Interface Type
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Organization
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Maximum Access Time
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Data Bus Width
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Maximum Operating Current
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Density in Bits
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Minimum Operating Temperature
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Maximum Operating Temperature
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CY14B108L-BA25XI

CY14B108L-BA25XIBy Infineon Technologies AG