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CY7C1019BV33-12VC

CY7C1019BV33-12VCInfineon Technologies AG


Description:

SRAM Chip Async Single 3.3V 1M-bit 128K x 8 12ns 32-Pin SOJ

Introduction date:

Jun 13, 2001

Updated: +90 days


See moreSRAM Chip by Infineon Technologies AG

Online version: https://www.datasheets.com/part-details/cy7c1019bv33-12vc-infineon-technologies-ag-17182031

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
noNo
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
3A991.b.2.b
Automotive
noNo
Supplier Cage Codeinfo
C6489
HTSUSAinfo
8542320041
Schedule Binfo
8542320040
Category Path
Semiconductor > Memory > Memory Chips > SRAM Chip

packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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Jedec
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Jedec info (PKG outline)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum Storage Temperature
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Minimum Storage Temperature
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Supplier Temperature Grade
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Process Technology
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I/O Mode
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Maximum Cycle Time
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Number of I/O Lines
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Read Latency
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Burst Length
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Function
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Density
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Timing Type
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Architecture
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Data Rate Architecture
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Maximum Clock Rate
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Maximum Access Time
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Number of Ports
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Number of Words
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Number of Bits per Word
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Operating Current
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Address Bus Width
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Density in Bits
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Minimum Operating Temperature
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Maximum Operating Temperature
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electrical circuitReference designs

Unlock inspiration and guidance with our collection of reference designs. Explore practical implementations showcasing the capabilities of the electronic component. Accelerate your development process and create efficient solutions with detailed documentation and schematics.

CY7C1019BV33-12VC

CY7C1019BV33-12VCBy Infineon Technologies AG