DM54LS158W/NOPB

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

PDF Download
(Latest Version)

Datasheet Preview

(Latest Version)

Select version:

Version: 07-DEC-2011 (Latest)

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Package Diameter (mm)

Package Material

Mounting

Package Outline

Jedec

Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Standard

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Maximum High Level Output Current

Propagation Delay Test Condition

Maximum Quiescent Current

Typical Quiescent Current

Power Supply Type

Maximum On Resistance

Minimum Dual Supply Voltage

Maximum Dual Supply Voltage

Maximum Low Level Output Current

Maximum Frequency

Maximum Storage Temperature

Typical Supply Current

Supplier Temperature Grade

Minimum Storage Temperature

Absolute Propagation Delay Time

Maximum Supply Current

Maximum Test Temperature

Minimum Test Temperature

Maximum Power Dissipation

Parity Invert Input

Number of Selection Inputs per Element

Number of Input Enables per Element

Number of Output Enables per Element

Maximum Propagation Delay Time @ Maximum CL

Input Signal Type

Output Signal Type

Logic Family

Logic Function

Process Technology

Configuration

Number of Elements per Chip

Number of Inputs per Chip

Number of Outputs per Chip

Polarity

Minimum Operating Supply Voltage

Output Type

Tolerant I/Os

Typical Operating Supply Voltage

Minimum Operating Temperature

Maximum Operating Supply Voltage

Maximum Operating Temperature

Crosses

Interested in More Free Data?

Discover a form-fit-function equivalent from another manufacturer or even suitable upgrades and downgrades, and much more.

Go Premium

No Credit Card. No Commitment.