FR107

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Version: 19-JAN-2013 (Latest)Version: 24-JAN-2011 Version: 27-FEB-2009 Version: 29-JAN-2008 Version: 01-JAN-2008 Version: 28-MAY-2006 Version: 14-OCT-2005 Version: 11-MAY-2003 Version: 09-APR-2002 Version: 24-MAY-2001

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Weight (g)

Mounting

Package Outline

Package Overall Height (mm)

Package Overall Width (mm)

Package Overall Length (mm)

Jedec

Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Reflow Temp. Source

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Wave Temp. Source

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Speed

Tradename

Material

Cathode Polarity

Process Technology

Repetitive Peak Forward Current

Average Rectified Forward Current

Maximum DC Reverse Voltage

Maximum RMS Reverse Voltage

Maximum Storage Temperature

Supplier Temperature Grade

Minimum Storage Temperature

Typical Junction Capacitance

Typical Reverse Recovery Charge

Type

Configuration

Peak Reverse Repetitive Voltage

Maximum Continuous Forward Current

Peak Non-Repetitive Surge Current

Peak Forward Voltage

Peak Reverse Current

Peak Reverse Recovery Time

Maximum Junction Ambient Thermal Resistance

Maximum Junction Case Thermal Resistance

Maximum Diode Capacitance

Maximum Power Dissipation

Minimum Operating Temperature

Maximum Operating Temperature

Operating Junction Temperature

Crosses

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