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H5DU5162ETR-E3C

H5DU5162ETR-E3C

SK hynix Inc

Description:

DRAM Chip DDR SDRAM 512Mbit 32Mx16 2.5V 66-Pin TSOP-II

Introduction date:

Nov 1, 2009

Updated: +90 days


See moreDRAM Chip by SK hynix Inc

Online version: https://www.datasheets.com/part-details/h5du5162etr-e3c-sk-hynix-inc-41554282

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
Yes with Exemption
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
9162F
HTSUSAinfo
8542320028
Schedule Binfo
8542320015
Category Path
Semiconductor > Memory > Memory Chips > DRAM Chip

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Minimum Storage Temperature
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Maximum Storage Temperature
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Number of I/O Lines
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Number of Bits per Word
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Supplier Temperature Grade
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Process Technology
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Refresh Cycles
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Maximum Refresh Cycle Time
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Operating Supply Voltage
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Density
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Type
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Interface Type
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Organization
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Maximum Clock Rate
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Maximum Access Time
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Number of Internal Banks
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Number of Words per Bank
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Minimum Operating Temperature
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Maximum Operating Temperature
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Data Bus Width
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Address Bus Width
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Maximum Operating Current
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Density in Bits
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H5DU5162ETR-E3C

H5DU5162ETR-E3CBy SK hynix Inc