HCPL-063N-000E

HCPL-063N-000E

Broadcom Inc
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Description:

Optocoupler Logic-Out Open Collector DC-IN 2-CH 8-Pin SOIC Tube

Country of Origin:

Philippines

Introduction date:

Feb 8, 2000

Updated: 09-MAR-2024


See moreLogic Output Photocouplers by Broadcom Inc

Online version: https://www.datasheets.com/part-details/hcpl-063n-000e-broadcom-inc-20387441

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
50434
HTSUSAinfo
8541498000
Schedule Binfo
8541498000
PPAP
noNo
AEC Qualified
noNo
Category Path
Optoelectronics, Lighting and Displays > Optoelectronics > PhotoCouplers > Logic Output Photocouplers

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Supplier Temperature Grade
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Minimum Supply Voltage
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Process Technology
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Maximum Working Insulation Voltage
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Maximum Propagation Delay Time (tPLH)
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Maximum Propagation Delay Time (tPHL)
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Common Mode Voltage
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Maximum Supply Voltage
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Minimum Common Mode Rejection
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Maximum Pulse Width Distortion
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Maximum Propagation Delay Skew
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Current Transfer Ratio Test Current
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Standardinfo
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Maximum Continuous Output Current
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Minimum Forward Current
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Maximum Forward Voltage
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Typical Forward Voltage
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Minimum Current Transfer Ratio
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Typical Fall Time
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Maximum Rise Time
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Typical Rise Time
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Maximum Propagation Delay Time
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Maximum Power Dissipation
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Minimum Forward Voltage
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Maximum Reverse Voltage
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Maximum Storage Temperature
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Minimum Storage Temperature
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Input Type
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Output Type
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Number of Channels per Chip
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Polarity
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Direction Type
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Minimum Isolation Voltage
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Logic Gate Type
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Minimum Operating Temperature
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Maximum Operating Temperature
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Maximum Current Transfer Ratio
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Maximum Data Rate
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Maximum Fall Time
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Maximum Forward Current
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HCPL-063N-000E

HCPL-063N-000EBy Broadcom Inc