HY27SS08121ATPIB

HY27SS08121ATPIB

SK hynix Inc

Description:

SLC NAND Flash Parallel 1.8V 512M-bit 64M x 8 15us 48-Pin TSOP-I

Introduction date:

Sep 1, 2004

Updated: 28-APR-2024


See moreFlash by SK hynix Inc

Online version: https://www.datasheets.com/part-details/hy27ss08121atpib-sk-hynix-inc-45326669

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2002/95/EC
ECCNinfo
3A991.b.1.a
Automotive
noNo
Supplier Cage Codeinfo
9162F
HTSUSAinfo
8542320071
Schedule Binfo
8542320070
Category Path
Semiconductor > Memory > Memory Chips > Flash

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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I/O Mode
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Maximum Cycle Time
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Process Technology
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Tradename
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Sector Size
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Density in Bits
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Command Compatible
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Bank Size
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Number of Banks
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Support of Page Mode
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Maximum Page Access Time
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Support of Common Flash Interface
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OE Access Time
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Simultaneous Read/Write Support
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Erase Suspend/Resume Modes Support
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ECC Support
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Page Read Current
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Program Current
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Page Size
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Programmability
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MMC Version
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Minimum Endurance
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Minimum Storage Temperature
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Maximum Storage Temperature
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Supplier Temperature Grade
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Density
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Cell Type
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Interface Type
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Timing Type
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Number of Words
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Number of Bits per Word
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Maximum Operating Frequency
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Maximum Access Time
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Maximum Erase Time
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Maximum Programming Time
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Architecture
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Programming Voltage
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Boot Block
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Location of Boot Block
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Maximum Operating Current
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Block Organization
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Address Bus Width
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Minimum Operating Temperature
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Maximum Operating Temperature
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HY27SS08121ATPIB

HY27SS08121ATPIBBy SK hynix Inc