IMB-H810-i2-R10

IMB-H810-i2-R10

IEI Integration Corp
Grade Your BOM

Description:

Motherboard, Intel CPU 16GB DDR3/DDR3L 1000Mbps 1920x1200Pixels

Introduction date:

Feb 16, 2015

Updated: 08-MAY-2024


See moreMotherboards by IEI Integration Corp

Online version: https://www.datasheets.com/part-details/imb-h810-i2-r10-iei-integration-corp-61503692

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
Automotive
noNo
Supplier Cage Codeinfo
SAW84
HTSUSAinfo
8471500150
Schedule Binfo
8471500150
PPAP
noNo
Category Path
Computer and Office Products > Computer Products > Applied Computing and Embedded Systems > Motherboards

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Product Weight (g)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Application
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CompactPCI Support
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Maximum Operating Supply Current
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Maximum Power Consumption
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Power Supply Type
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Processor Thermal Design Power
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Intel Technologies
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Front Side Bus
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Data Cache Size
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ECC Support
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Watchdog Timer
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PS/2
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VGA
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Video In
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Mic In
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Audio Interfaces
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eDP
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RS232/422/485
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RS485
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RS232
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Minimum Storage Temperature
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Maximum Storage Temperature
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PCI Mini
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PCIe Mini
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PCMCIA
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PCIe x1
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PCIe x2
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PCIe x3
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PCIe x4
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PCIe x8
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PCIe x16
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PCI-X
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Product Weight
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Minimum Storage Humidity
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Maximum Storage Humidity
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Maximum Operating Humidity
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Minimum Operating Humidity
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RS422
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GPIO
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UART
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I2C
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SMBus
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SPI
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cPCI
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Display Interface
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Warranty
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Color
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CPU Socket
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Form Factor
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Processor Type
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Operating Systems
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Processor Speed
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Processor Family
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Number of System Memory
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Processor Number
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System Memory Maximum Size
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Processor Cores
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System Memory Type
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Minimum Operating Supply Voltage
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Ethernet Speed
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Typical Operating Supply Voltage
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Ethernet Controller Type
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Maximum Operating Supply Voltage
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Ethernet Card Number of Connectors
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System Memory Number of Socket Pins
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System Memory Socket Type
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On Board Ethernet Card
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System Memory Speed
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Chipset Type
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On Board Graphic Card
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Graphic Card Resolution
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Display Type
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Graphics Memory Allocation
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Display Chipset Type
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On Board Sound Card Type
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PCI
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AGP
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PATA
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SATA
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USB
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BIOS
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Type
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Slot Support
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Minimum Operating Temperature
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Maximum Operating Temperature
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Product Height
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processorCrosses

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IMB-H810-i2-R10

IMB-H810-i2-R10By IEI Integration Corp