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K4E8E304EE-EGCE

K4E8E304EE-EGCE

Description:

DRAM Chip Mobile LPDDR3 SDRAM 8Gbit 178-Pin FBGA

Manufacturer:

Samsung Electronics

Introduction date:

Oct 17, 2014

Last Updated Date: 09 OCT 2023

See moreDRAM Chip by Samsung Electronics

Online version: https://www.datasheets.com/part-details/k4e8e304ee-egce-samsung-electronics-74602172

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
rocketPremium
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
1542F
HTSUSAinfo
8542320036
Schedule Binfo
8542320023
Taxonomy Path
Semiconductor > Memory > Memory Chips > DRAM Chip

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

PDF Download

Revision date:

Datasheet Preview

packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
infolock
Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Package Diameter (mm)
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Mounting
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Package Outline
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum Storage Temperature
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Minimum Storage Temperature
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Operating Supply Voltage
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Supplier Temperature Grade
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Number of Bits per Word
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Number of I/O Lines
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Process Technology
infolock
Refresh Cycles
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Maximum Refresh Cycle Time
infolock
Density
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Type
infolock
Interface Type
infolock
Organization
infolock
Maximum Clock Rate
infolock
Maximum Access Time
infolock
Number of Internal Banks
infolock
Number of Words per Bank
infolock
Typical Operating Supply Voltage
infolock
Minimum Operating Supply Voltage
infolock
Maximum Operating Supply Voltage
infolock
Minimum Operating Temperature
infolock
Maximum Operating Temperature
infolock
Data Bus Width
infolock
Address Bus Width
infolock
Maximum Operating Current
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Density in Bits
infolock
K4E8E304EE-EGCE

K4E8E304EE-EGCE

Manufacturer:Samsung Electronics

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