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KMQE60013M-B318

KMQE60013M-B318

Description:

Multi-Chip Package Memory (MCP)

Manufacturer:

Samsung Electronics

Last Updated Date: 04 SEP 2023

See moreMulti-Chip Package Memory by Samsung Electronics

Online version: https://www.datasheets.com/part-details/kmqe60013m-b318-samsung-electronics-422091678

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
rocketPremium
EU RoHS
rohs unknownUnknown
RoHS Version
2002/95/EC
Automotive
noNo
Supplier Cage Codeinfo
1542F
HTSUSAinfo
8542320071
Schedule Binfo
8542320070
PPAP
noNo
Taxonomy Path
Semiconductor > Memory > Memory Chips > Multi-Chip Package Memory

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Package Diameter (mm)
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Mounting
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Package Outline
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KMQE60013M-B318

KMQE60013M-B318

Manufacturer:Samsung Electronics

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