KTL-TCM58BS/4G

KTL-TCM58BS/4G

Kingston Technology
Grade Your BOM

Description:

DRAM Module DDR3 SDRAM 4Gbyte

Introduction date:

Sep 7, 2015

Updated: +90 days


See moreMemory Modules by Kingston Technology

Online version: https://www.datasheets.com/part-details/ktl-tcm58bs-4g-kingston-technology-66948649

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs unknownUnknown
RoHS Version
2002/95/EC
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
0P2J5
HTSUSAinfo
8473301140
Schedule Binfo
8473300002
Category Path
Semiconductor > Memory > Memory Cards and Modules > Memory Modules

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Package Diameter (mm)
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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PC Type
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Minimum Storage Temperature
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Maximum Storage Temperature
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Total Density in Bits
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Supplier Temperature Grade
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Refresh Cycles
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Self Refresh
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Module Sides
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PLL
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Number of Module Banks
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SPD EEPROM Support
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Number of Chip Banks
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Maximum Refresh Cycle Time
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Warranty
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Process Technology
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Main Category
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Total Density
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Subcategory
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Maximum Clock Rate
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Maximum Access Time
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Organization
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Number of Chip per Module
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Chip Density
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Module Type
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Data Bus Width
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Chip Configuration
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ECC Support
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Number of Ranks
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Chip Package Type
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Operating Current
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CAS Latency
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Minimum Operating Temperature
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Maximum Operating Temperature
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