LMX2592RHAR

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Weight (g)

Package Material

Mounting

Package Outline

Package Overall Height (mm)

Package Overall Width (mm)

Package Overall Length (mm)

Jedec

Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Standard

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Supplier Temperature Grade

Maximum Storage Temperature

Maximum Supply Current

Internal/External Clock Type

Number of Clock Inputs

Maximum Cycle to Cycle Jitter

Typical Phase Jitter (RMS)

Typical Period Jitter (RMS)

Maximum Output Skew

Output Supply Voltage

Input Signal Type

Output Signal Type

Hitless Protection Switching

Frequency Margining

Programmability

User Programming Method

Spread Spectrum

Number of PLL

Process Technology

Serial Management Interface

Maximum Quiescent Current

Typical Duty Cycle

Maximum Output Frequency

Minimum Storage Temperature

Number of Outputs per Chip

Input Logic Level

Output Logic Level

Clock Input Frequency

Minimum Operating Supply Voltage

Maximum Operating Supply Voltage

Maximum Power Dissipation

Minimum Operating Temperature

Maximum Operating Temperature

Typical Operating Supply Voltage

Reference designs

Unlock inspiration and guidance with our collection of reference designs. Explore practical implementations showcasing the capabilities of the electronic component. Accelerate your development process and create efficient solutions with detailed documentation and schematics.

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CAD Models

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