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M471B5173DB0-YK0

M471B5173DB0-YK0Samsung Electronics


Description:

DRAM Module DDR3 SDRAM 4Gbyte 204USODIMM

Introduction date:

Dec 17, 2009

Updated: +90 days


See moreMemory Modules by Samsung Electronics

Online version: https://www.datasheets.com/part-details/m471b5173db0-yk0-samsung-electronics-80267513

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
4A994.a
Automotive
noNo
Supplier Cage Codeinfo
1542F
HTSUSAinfo
8473301140
Schedule Binfo
8473300002
Category Path
Semiconductor > Memory > Memory Cards and Modules > Memory Modules

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Process Technology
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Warranty
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Maximum Refresh Cycle Time
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Refresh Cycles
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Self Refresh
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Module Sides
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PLL
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Number of Module Banks
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SPD EEPROM Support
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Number of Chip Banks
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PC Type
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Maximum Storage Temperature
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Minimum Storage Temperature
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Supplier Temperature Grade
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Total Density in Bits
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Main Category
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Total Density
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Subcategory
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Maximum Clock Rate
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Maximum Access Time
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Organization
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Number of Chip per Module
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Chip Density
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Module Type
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Data Bus Width
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Chip Configuration
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ECC Support
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Number of Ranks
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Chip Package Type
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Operating Current
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CAS Latency
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Minimum Operating Temperature
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Maximum Operating Temperature
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M471B5173DB0-YK0

M471B5173DB0-YK0By Samsung Electronics