MCIMX6Y1DVK05AA

MCIMX6Y1DVK05AA

NXP Semiconductors

Description:

SOC i.MX 6ULL ARM Cortex A7 40nm 272-Pin MAP-BGA Tray

Updated: 15-APR-2024


See moreApplication Processors and SOCs by NXP Semiconductors

Online version: https://www.datasheets.com/part-details/mcimx6y1dvk05aa-nxp-semiconductors-79947186

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
5A992.c
Automotive
noNo
Supplier Cage Codeinfo
H2J65
HTSUSAinfo
8542310001
Schedule Binfo
8542310050
Category Path
Semiconductor > Embedded Controllers and Systems > Embedded Systems > Application Processors and SOCs

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Data Memory Size
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Minimum Storage Temperature
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Supported PMIC Devices
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Data Cache Size
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Instruction Cache Size
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Display Interface
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PCI
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External Memory Interface
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External Memory Speed
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Tradename
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ISM Band
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Solutions
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Maximum Expanded Memory Size
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PWM
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Temperature Flag
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Supplier Temperature Grade
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Maximum Storage Temperature
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Watchdog
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Maximum Power Dissipation
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Family Name
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Type
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Core Architecture
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Device Core
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Maximum Clock Rate
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Data Bus Width
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Maximum Speed
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Program Memory Type
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Minimum Operating Supply Voltage
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Program Memory Size
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RAM Size
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Number of ADCs
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ADC Channels
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ADC Resolution
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Number of DACs
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DAC Channels
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DAC Resolution
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Typical Operating Supply Voltage
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Maximum Operating Supply Voltage
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Number of Programmable I/Os
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Application
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Processing Unit
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Ethernet Interface Type
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Ethernet Speed
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Interface Type
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SPI
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I2C
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I2S
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UART
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USB
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USART
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CAN
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Ethernet
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Number of Timers
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Programmability
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Process Technology
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Minimum Operating Temperature
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Maximum Operating Temperature
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MCIMX6Y1DVK05AA

MCIMX6Y1DVK05AABy NXP Semiconductors