MDM9240

MDM9240

QUALCOMM
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Description:

Snapdragon X12 LTE Modem

Updated: 02-JUN-2024


See moreModem Chip by QUALCOMM

Online version: https://www.datasheets.com/part-details/mdm9240-qualcomm-406750872

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs unknownUnknown
RoHS Version
2011/65/EU
Automotive
rohs unknownUnknown
Supplier Cage Codeinfo
1DN14
HTSUSAinfo
8542390001
Category Path
Semiconductor > Communication > Modems > Modem Chip

packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Package Family Name
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Supplier Package
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Package Description
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Mounting
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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processorCrosses

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MDM9240

MDM9240By QUALCOMM