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MKW30Z160VHM4

MKW30Z160VHM4

NXP Semiconductors

Description:

Wireless Bluetooth Low Energy

Introduction date:

Jan 14, 2015

Updated: 21-APR-2024


See moreBluetooth by NXP Semiconductors

Online version: https://www.datasheets.com/part-details/mkw30z160vhm4-nxp-semiconductors-61097471

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
5A992.c
Automotive
noNo
Supplier Cage Codeinfo
H2J65
HTSUSAinfo
8542310001
PPAP
noNo
Category Path
Semiconductor > RF and Microwave > RF Modules > Bluetooth

pdfDatasheet

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Width (mm)info
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Package Height (mm)info
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Typical Insertion Loss
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Maximum Input Power
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Tradename
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Process Technology
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Antenna Mounting
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Processing Unit Type
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Special Features
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Operating Supply Voltage
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Maximum Power Dissipation
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Typical Sensitivity
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Interface Type
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Maximum Storage Temperature
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Supplier Temperature Grade
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Minimum Storage Temperature
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Protocols Supported
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Type
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Power Class
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Maximum Data Rate
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Minimum Operating Frequency
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Maximum Operating Frequency
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Solutions
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ISM Band
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Minimum Operating Temperature
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Maximum Operating Temperature
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Standby Current
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Maximum Supply Current
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CADsCAD Models

Access 3D CAD models, symbols, and footprints of the component. Visualize its structure and dimensions, integrate designs, and optimize performance effortlessly.

MKW30Z160VHM4

MKW30Z160VHM4By NXP Semiconductors