MMBT3906LT1G

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Weight (g)

Package Material

Mounting

Package Outline

Package Overall Height (mm)

Package Orientation Marking Type

Package Orientation

Package Overall Width (mm)

Package Overall Length (mm)

Jedec

Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Standard

Reflow Temp. Source

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Collector Current for VCE Saturation

Minimum Transition Frequency

Typical Transition Frequency

Process Technology

Maximum Diode Forward Voltage

Maximum Pulsed Collector Current

Maximum Offset Voltage

Maximum Turn-On Time

Maximum Storage Time

Maximum Fall Time

Maximum Turn-Off Time

Maximum Noise Figure

Maximum Delay Time

Maximum Rise Time

Supplier Temperature Grade

Minimum Storage Temperature

Maximum Collector Cut-Off Current

Maximum Emitter Cut-Off Current

Maximum Junction Ambient Thermal Resistance

Maximum Junction Case Thermal Resistance

Typical Input Capacitance

Typical Output Capacitance

Maximum Base Emitter Saturation Voltage

Maximum Collector-Emitter Saturation Voltage

Output Power

Maximum Storage Temperature

Maximum Base Current

Operating Junction Temperature

Type

Configuration

Number of Elements per Chip

Maximum Collector Base Voltage

Maximum Emitter Base Voltage

Maximum Collector-Emitter Voltage

Maximum DC Collector Current

Maximum Power Dissipation

Material

Minimum DC Current Gain

Maximum Transition Frequency

Category

Minimum Operating Temperature

Maximum Operating Temperature

CAD Models

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Crosses

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