MPC8548EHXATGA

MPC8548EHXATGA

NXP Semiconductors
Grade Your BOM

Description:

MPU PowerQUICC III RISC 32bit 0.09um 1.2GHz 1.8V/2.5V/3.3V 783-Pin FCCBGA

Introduction date:

Jan 28, 2006

Updated: 10-OCT-2024


See moreMicroprocessors - MPUs by NXP Semiconductors

Online version: https://www.datasheets.com/part-details/mpc8548ehxatga-nxp-semiconductors-34482726

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
noNo
RoHS Version
2011/65/EU, 2015/863
Automotive
noNo
Supplier Cage Codeinfo
H2J65
HTSUSAinfo
8542310045
Schedule Binfo
8542310045
PPAP
noNo
Category Path
Semiconductor > Microcontrollers and Processors > Processors > Microprocessors - MPUs

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Overall Width (mm)
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Package Overall Length (mm)
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Programmability
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Tradename
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Maximum Power Dissipation
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Temperature Flag
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Memory Card Interface
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On-Chip Memory
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Supplier Temperature Grade
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Operating Supply Voltage
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I/O Voltage
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Maximum Storage Temperature
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Minimum Storage Temperature
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Family Name
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Data Bus Width
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Instruction Set Architecture
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SATA
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PCIe
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Operating Systems
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Low Power Mode
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Graphics Acceleration
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External Memory Interface
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Core Architecture
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Device Core
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Number of CPU Cores
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Maximum Speed
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Interface Type
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CAN
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Minimum Operating Supply Voltage
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UART
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Typical Operating Supply Voltage
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USART
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I2C
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SPI
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USB
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Ethernet
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I2S
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Instruction Cache Size
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Data Cache Size
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Multiply Accumulate
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Ethernet Interface Type
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Ethernet Speed
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Maximum Operating Supply Voltage
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Process Technology
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Minimum Operating Temperature
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Maximum Operating Temperature
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