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MTA18ASF4G72PZ-3G2E1

MTA18ASF4G72PZ-3G2E1

Micron Technology

Description:

DRAM Module DDR4 SDRAM 32Gbyte 288RDIMM Tray

Country of Origin:

China

Introduction date:

Aug 10, 2020

Updated: +90 days


See moreMemory Modules by Micron Technology

Online version: https://www.datasheets.com/part-details/mta18asf4g72pz-3g2e1-micron-technology-419314017

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
4A994.a
Automotive
noNo
Supplier Cage Codeinfo
6Y440
HTSUSAinfo
8473301140
Schedule Binfo
8473300002
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > Memory > Memory Cards and Modules > Memory Modules

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Jedec
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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PC Type
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Minimum Storage Temperature
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Maximum Storage Temperature
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Total Density in Bits
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Supplier Temperature Grade
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Refresh Cycles
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Self Refresh
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Module Sides
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PLL
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Number of Module Banks
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SPD EEPROM Support
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Number of Chip Banks
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Maximum Refresh Cycle Time
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Warranty
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Process Technology
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Main Category
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Total Density
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Subcategory
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Maximum Clock Rate
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Maximum Access Time
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Organization
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Number of Chip per Module
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Chip Density
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Module Type
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Data Bus Width
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Chip Configuration
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ECC Support
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Number of Ranks
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Chip Package Type
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Operating Current
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CAS Latency
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Minimum Operating Temperature
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Maximum Operating Temperature
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MTA18ASF4G72PZ-3G2E1

MTA18ASF4G72PZ-3G2E1By Micron Technology